- Location: San Jose, CA
The RMA engineer is responsible for confirming, isolating and identifying IC, process, Software, Test, and Package failures and to determine root cause. Develop, characterize, and optimize FA techniques, tools and protocols. Establishing processes and methods to track and report Failure analysis status, records, and trends. Perform failure analysis including electrical, thermal and mechanical characteristics of integrated circuits, components, packages, and field environments to determine the root cause of failure. -Establish an Analysis Plan for each case to ensure that TAT objectives are met. -Coordinating with external labs to perform fault isolation to identify failure mechanisms(s) -Perform electrical bench testing and interpret ATE data logs to aid in localizing electrical failures. -Work with designers and engineering groups to isolate root cause of failures. Generate and when necessary present detailed failure analysis reports for both internal and external customers. Additional responsibilities: -Support REE in Failure Analysis of Qualification failures. -Support PTE in Failure Analysis of Low Yield and O/S failures -Develop and apply an FMEA approach to projects and integrate work with program managers to install the methodology early on in any program. -Maintain understanding of technical roadmaps and latest technology trends in integrated circuits and packaging -Interface with Product Engineering, manufacturing, and design as needed for various product quality and reliability related issues -Provide technical customer support regarding failure analysis reports and miscellaneous correspondence as required by the customers. -Manage Failure Analysis Response times to meet customer expectations.
Candidate should be familiar with Commercial and Automotive quality and reliability standards and methods. Candidate should be familiar with standard engineering laboratory equipment including Curve Tracer, Oscilloscopes, Waveform Generators, Network & Spectrum Analyzers The candidate will also have sufficient familiarity or proficiency with the operation and application of standard failure analysis tools including: X-ray analysis, Acoustic Microscopy (CSAM), Light Microscopy use of Parameter Analyzers, Network Analyzers, Oscilloscopes, Wet and Dry chemical die de-processing techniques, IR microscopy, OBIRCH, Focused Ion Beam (FIB)photon emission microscopy (PEM) and SEM/EDS analysis
Candidate should possess a Bachelor of Science degree in a related field. Masters preferred Candidate should have a minimum of 2 years experience in semiconductor failure analysis, design, or Product and Test Engineerin
Required: Bachelor's, Electrical Engineering and/or Industrial & Prod Engineering and/or Materials Science